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Semiconductor companies must collaborate with a variety of supply chain partners. These partners include vendors of electronic design automation (EDA) software, intellectual property (IP) core companies, chip foundries, and outsourced assembly and test (OSAT) providers. Using AWS solutions, semiconductor companies can reduce the time to create a collaborative engineering solution from days or weeks to minutes. Customers can use collaborative engineering solutions directly through AWS CloudFormation templates and related documentation or through an AWS Partner. Additionally, semiconductor foundries offer solutions built on AWS for remote collaborative engineering. Qualified system integrator partners that serve the semiconductor industry as managed service providers also offer collaborative solutions.
Cadence OnCloud is a SaaS software platform for all your system design and simulation needs that can operate on any hardware, removing the requirement to run and maintain expensive infrastructure hardware.
The Cadence OnCloud Platform is a solution-enablement solution providing multiple software packages for your specific engineering discipline; PCB design, Multiphysics analysis, and Computational Fluid Dynamics (CFD) analysis.
TSS is a web-based Electronic Design Automation (EDA) collaboration platform for the U.S. manufacturing supply chain supporting the entire life-cycle of trusted and assured microelectronics.
RONIN takes the complexity out of the AWS offerings to provide an easy to use and secure self-service research platform. RONIN is installed as an orchestration engine that runs in a user's own account. It is available as RONIN Core (with public network access) or RONIN Isolate (accessible only through an institution's private network)
Teamcenter helps people across the enterprise make smarter product and business decisions, achieve their innovation goals, and transform their business through digitalization. Teamcenter on the cloud simplifies PLM deployment to save companies time and money with best in class technology.
This Guidance helps you enable trusted communication for intellectual property (IP) design and data exchange in a secure environment. It includes a high-level architecture for well-optimized design environments to facilitate collaboration with third-party companies. Third-party companies may include foundries, independent software vendors (ISVs), and outsourced design services.