Overview
This Guidance demonstrates how to implement a cloud-bursting solution that seamlessly extends your on-premises semiconductor workflows to the cloud. It allows you to run hybrid or entirely cloud-based semiconductor design and verification workflows on AWS while utilizing your existing on-premises chip design environments based on IBM Spectrum Load Sharing Facility (LSF) and NetApp storage.
How it works
This architecture diagram shows how to provide compute capacity with design data caching using a multi-Region approach.
Deploy with confidence
Ready to deploy? Review the sample code on GitHub for detailed deployment instructions to deploy as-is or customize to fit your needs.
Well-Architected Pillars
The architecture diagram above is an example of a Solution created with Well-Architected best practices in mind. To be fully Well-Architected, you should follow as many Well-Architected best practices as possible.
Disclaimer
The sample code; software libraries; command line tools; proofs of concept; templates; or other related technology (including any of the foregoing that are provided by our personnel) is provided to you as AWS Content under the AWS Customer Agreement, or the relevant written agreement between you and AWS (whichever applies). You should not use this AWS Content in your production accounts, or on production or other critical data. You are responsible for testing, securing, and optimizing the AWS Content, such as sample code, as appropriate for production grade use based on your specific quality control practices and standards. Deploying AWS Content may incur AWS charges for creating or using AWS chargeable resources, such as running Amazon EC2 instances or using Amazon S3 storage.
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