AWS for Industries
DAC 2021 Recap
58th Annual Design Automation Conference
The 58th annual Design Automation Conference took place in San Francisco from December 5 – 9, 2021. The Design Automation Conference (DAC) is the premier event devoted to the design and design automation of electronic systems and circuits. DAC focuses on the latest methodologies and technology advancements in electronic design.
The 58th DAC will bring together researchers, designers, practitioners, tool developers, students and vendors.
There’s still time to register for Virtual DAC
This year, AWS exhibited with an onsite booth and participated in the Design On Cloud theater. In case you missed us, there is still time to register for Virtual DAC, December 13 – January 1. Take advantage of the exclusive DAC Virtual Registration Package which will grant you access to a select number of sessions along with limited networking capabilities on DAC’s virtual platform from the comfort of your own home or office.
Register here: https://www.dac.com/Attend/Virtual-Registration
Highlights from this year’s event
AWS presentation at the Design on Cloud Theater
Worldwide Head of Business Development for Semiconductors at AWS, David Pellerin, presented in the Design on Cloud Theater. His session titled, Cloud-Based Design for Design, Verification, and Manufacturing, provided an overview of how Amazon semiconductor teams use cloud for secure collaboration. He also highlighted how the secure sharing of data can benefit the entire semiconductor supply chain from design and verification, to fab and packaging.
Modern silicon design requires collaboration with worldwide stakeholders, using a wide range of EDA and IP products. Cloud enables distributed teams to securely manage and monitor their EDA and IP assets during collaborative projects, while also allowing actionable insights on design, verification, and manufacturing-related data.
AWS and Siemens EDA Co-Presentation
Kenneth Chang (AWS), Dnyanesh Digraskar (AWS), Matthieu Fillaud (Siemens EDA), and Wei-Lii Tan (Siemens EDA) teamed up to present Utilizing the Cloud to Increase Library Characterization Throughput and Reduce Schedule Bottlenecks.
This session presented the steps taken and the choices made in setting up a cloud environment for characterization workloads, and quantify scaling efficiency results from a validated test case. This presentation also shared how with the correct configuration, cloud is a valid method providing “burst” compute power to accelerate high priority workloads, while being able to off-load on-premises tasks when needed.
AWS booth showcases solutions for EDA workflows
This year, the AWS booth featured two interactive demos, showcasing solutions for EDA workflows.
On one side of our booth, NetApp and AWS jointly demonstrated customer EDA verification environments running in a Hybrid Cloud configuration, leveraging the recently announced Amazon FSx for NetApp ONTAP. This demo showed our ability to rapidly, securely, and elastically move design tools and libraries from the Datacenter to the Cloud. Workload management tools are used to dynamically allocate resources required by jobs submitted for execution, highlighting unique automation capabilities provided by the NetApp and AWS partnership for EDA workflows, enabling cloud-scale performance and seamless data movement between the Datacenter to the Cloud.
On the other side of our booth we also showcased an overview and demo of the AWS Solution, Scale-out Computing on AWS, demonstrating how it can be used to deploy a turn-key EDA computing environment in minutes.
Summary and resources
Thank you to everyone who attended this year’s event. And if you didn’t get a chance to join us in person, you can still watch the speaking sessions virtually online.
For more information on AWS for Semiconductor, visit our website.
To learn more about the event, visit the DAC event website.