With the imminent coexistence of electrical and optical components at the chip and board level, it is important to provide designers with a reliable simulation framework that can accurately and efficiently predict signal behaviour in opto-electronic integrated circuits and boards.
Equations governing optical and electrical components are incompatible for co-simulation within traditional numerical engines. In addition, optoelectronic components are temperature dependent and this dependence needs to be incorporated into the simulation to obtain correct results. Temperature effects are particularly important for the modeling of optical devices integrated on a common substrate with high power electrical components such as laser drivers. In this case the close proximity of the electronics and optical elements such as lasers produces significant thermal coupling. The coupling of the electrical, optical and thermal domains in such a situation requires a self-consistent solution.

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